The 800GBASE-SR8 OSFP Optical Transceiver Module is designed for 800GBASE Ethernet throughput up to 50m over OM4 multimode fiber (MMF) using a wavelength of 850nm via dual MTP/MPO-12 connectors. This transceiver is compliant with IEEE P802.3ck, OSFP MSA. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet, Data Center and Breakout 2x 400G SR4 application.
单击打开
Customized OSFP 800GBASE-SR8 Finned Top PAM4 850nm 50m DOM Dual MPO-12/APC MMF Optical Transceiver Module, Support 2 x 400G-SR4
New #235149
New #235149
￥6,399.00
FS P/N: OSFP-SR8-800GFS P/N: OSFP-SR8-800G
0 销量
0 评价
0 问答
兼容品牌:
NVIDIA (InfiniBand)
设备型号:
标签服务:
3件现货 武汉仓, 预计2024年7月04日送达
6件在途库存 , 最快2024年7月15日送达
查看更多仓储
运输到 中国大陆
免运费 顺丰速运
产品和项目咨询
解决方案设计
5 年保修
Customized 800GBASE-SR8 OSFP Finned Top Optical Transceiver Module (MMF, 850nm, 50m, Dual MTP/MPO-12, DOM)
Specifications
Part Number
OSFP-SR8-800G
Vendor Name
FS
Form Factor
OSFP Finned Top
Max Data Rate
850Gbps (8x 106.25Gbps)
Wavelength
850nm
Max Cable Distance
30m@OM3/50m@OM4
Connector
Dual MTP/MPO-12 APC
Media
MMF
Transmitter Type
VCSEL
Receiver Type
PD
TX Power
-4.6~4dBm
Minimum Receiver Power
-6.4dBm
Powerbudget
1.8dB
Receiver Overload
4dBm
Power Consumption
≤14W
Extinction Ratio
＞2.5dB
DDM/DOM
Supported
Commercial Temperature Range
0 to 70°C (32 to 158°F)
CDR (Clock and Data Recovery)
TX & RX Built-in CDR
Inbuilt FEC
Yes
Protocols
OSFP MSA 5.0, CMIS 5.1
Warranty
5 Years
Quality Testing Program
Quality Testing Program
Optical Transceivers Testing Learn more
.svg)
应用方案
特征概述
Leading Performance and Quality for 800G
Built-in Broadcom DSP Chip, the OSFP transceiver offers high-speed, and low-power in 800G links.
Broadcom 7nm DSP Chip
Stable Transmission
≤14W
Low Power Consumption
VCSEL Laser
Ensure Production
Center Wavelength | 850nm | 1310nm | 1310nm |
Connector | Dual MTP/MPO-12 | MTP/MPO-16 | MTP/MPO-16 |
Cable Distance (Max.) | 50m | 500m | 2km |
Modulation | 8x106.25G PAM4 | 8x106.25G PAM4 | 8x106.25G PAM4 |
Transmitter Type | VCSEL | EML | EML |
Packaging Technology | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging | COB (Chip on Board) Packaging |
Chip | Broadcom 7nm DSP | Broadcom 7nm DSP | Broadcom 7nm DSP |
Power Consumption | ≤14W | ≤16.5W | ≤16.5W |
Application | Ethernet Data Center 800G to 2x400G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout | Ethernet Data Center 800G to 2x400G Breakout 800G to 8x100G Breakout |
用户提问
提问
成为第一个 提问
用户评价
评论
尚未评价。成为第一个 撰写评论
资源下载
历史浏览记录