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這張圖片是關於21.
這張圖片是關於21.
這張圖片是關於1.
這張圖片是關於1.
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這張圖片是關於21.
這張圖片是關於21.
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Customized QSFP-DD 800GBASE-SR8 PAM4 850nm 50m DOM MPO-16/APC MMF Optical Transceiver Module

#234443
#234443

Broadcom 7nm DSP ≤13W VCSEL MTP/MPO-16 MMF

HK$10,848.00
FS P/N: QDD-SR8-800G
FS P/N: QDD-SR8-800G
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兼容品牌:
思科(Cisco)
設備型號:
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可提前預購, Ship by 18 Dec, 2024送達
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5 年保修

Customized 800GBASE-SR8 QSFP-DD Optical Transceiver Module (MMF, 850nm, 50m, MTP/MPO-16, DOM)

The 800GBASE-SR8 QSFP-DD Optical Transceiver Module supports up to 50m link lengths over multi-mode fiber (MMF) via MTP/MPO-16 connectors. This transceiver is compliant with IEE802.3ck, CMIS 5.0 and QSFP-DD MSA standards. The built-in digital diagnostics monitoring (DDM) allows access to real-time operating parameters. It is suitable for 800G Ethernet.

Note: The FS P/N is changed from QDD800-SR8-B1 to QDD-SR8-800G, but the product is the same. Only the FS P/N has been changed.

Specifications
Part Number
QDD-SR8-800G
Vendor Name
FS
Form Factor
QSFP-DD
Max Data Rate
850Gbps (8x 106.25Gbps)
Wavelength
850nm
Max Cable Distance
30m@OM3/50m@OM4
Connector
MTP/MPO-16
Cable Type
MMF
Transmitter Type
VCSEL
Receiver Type
PIN
TX Power
-4.6-4dBm
Minimum Receiver Power
-6.4dBm
Powerbudget
2dB
Receiver Overload
4dBm
Power Consumption
≤13W
Extinction Ratio
>2.5dB
Packaging Technology
COB (Chip on Board) Packaging
Modulation Format
PAM4
CDR (Clock and Data Recovery)
TX and RX Built-in DSP
Inbuilt FEC
Yes
Protocols
IEEE 802.3ck-2022, CMIS 5.0
Warranty
5 Years
質量認證
獲取詳細的認證信息,請訪問合規中心
注: 安裝第三方光模組不會影響您的網絡設備的質保服務,設備使用手冊中也有說明產品的保修服務不受第三方光模組的影響。
特徵概述
Leading Performance and Quality for 800G
Built-in Broadcom DSP Chip, the QSFP-DD transceiver offers higgh-speed and low-power in 800G links.
Broadcom 7nm DSP Chip
Stable Transmission
≤13W
Low Power Consumption
VCSEL Laser
Ensure Production
Center Wavelength
850nm
1310nm
1310nm
1311nm
Connector
MTP/MPO-16
MTP/MPO-16
MTP/MPO-16
MTP/MPO-16
Cable Distance (Max.)
30m@OM3/50m@OM4
500m@SMF
2km
10km
Modulation
8x106.25G PAM4
8x106.25G PAM4
8x106.25G PAM4
8x106.25G PAM4
Transmitter Type
VCSEL
EML
EML
EML
Packaging Technology
COB (Chip on Board)
Packaging
COB (Chip on Board)
Packaging
COB (Chip on Board)
Packaging
COB (Chip on Board)
Packaging
Chip
Broadcom 7nm DSP Chip
Broadcom 7nm DSP Chip
Broadcom 7nm DSP Chip
Broadcom 7nm DSP Chip
Power Consumption
≤13W
≤16.5W
≤18W
≤18W
Application
Ethernet
Data Center
Ethernet
Data Center
800G to 2x400G Breakout
800G to 8x100G Breakout
Ethernet
Data Center
800G to 2x400G Breakout
800G to 8x100G Breakout
Ethernet
Data Center
800G to 2x400G Breakout
800G to 8x100G Breakout
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B***r

United States

December 25, 2023
5.0
Installation and usage of SR8 modules are very convenient. They can be easily matched with our existing multi-mode patch cords without the need to purchase additional accessory products.
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